New from Omnetics Connector Corporation. Standardised High Speed Nano-D range
Up to 20Gbps per differential pair. Modified insulators of the normal 0.64mm pitch Nano-D utilising MIL-DTL-32139 compliant contact
Come to Genalog for your quote and up to 12 month stock holding options
New from Omnetics Connector Corporation. Standardised High Speed Nano-D range
Up to 20Gbps per differential pair. Modified insulators of the normal 0.64mm pitch Nano-D utilising MIL-DTL-32139 compliant contact
Come to Genalog for your quote and up to 12 month stock holding options
Choose from standard part numbers, filter by chosen attributes
The High-Speed Nano-D uses modified insulators and pin arrangements to optimize impedance and performance for high-speed or high-density signal routing. 1 Amp pre-wired parallel pair cable and PCB solutions deliver up to 20 Gbps performance per differential pair. High-Speed connectors and cables are optimized for gigabit digital applications and protocols such as: USB 3.0, 10GbE, Camera Link, and PCIe. These high performance Mil-Aero style Nano-D connectors are built using Omnetics MIL-DTL-32139 compliant Flex Pin contact solution.
The High-Speed connector solutions have the ability to withstand high shock and vibration while maintaining signal integrity.
Turnkey pre-wired factory cables and PCB connector solutions. Unique contact isolation and spacing for optimal performance up to 20 Gbps. Uses 30 AWG parallel pair High-Speed cable. 1 Amp Flex Pin contacts performance in high vibrations and shock environments.
| Electro-Mechanical Specifications | |
| TYPE | PERFORMANCE |
| Durability | > 2000 Mating Cycles min |
| Temperature | -55ºC to +125 ºC |
| Current rating | 1 Amp per contact |
| Voltage Rating (DWV) | 250 VAC RMS Sea Level |
| Insulation Resistance | 5,000 Megohms @ 100 VDC |
| Shock | 100 g’s discontinuity < 10 nanoseconds |
| Vibration | 20 g’s discontinuity < 10 nanoseconds |
| Thermal Vacuum Outgassing | 1.0% max TML, 0.1% VCM |
| Contact Resistance | 71 milliohms (71 mV) max @ 1 Amp |
| Mating/Unmating Force | 2.5 oz. (.71g) typical per contact |
| Material Specifications | |
| Contact | Copper Alloy Per MIL-DTL-32139 |
| Contact Finish | Gold per ASTM B488, Type II, Class 1.27, Code C Over Nickel Underplate |
| Insulator | LCP Per MIL-DTL-32139 Or PEEK |
| Encapsulant | Epoxy |
| Shell Options | |
| Aluminium 6061 | Electroless Nickel per SAE-AMS-2404 |
| Stainless Steel, 300 Series | Passivated per SAE-AMS-2700 |
